Company Profile
Shenglan Semiconductor (Changzhou) Co., Ltd. was established on April 12, 2023. It is a professional enterprise engaged in the development, production, and sales of piezoelectric thin film wafers and related specialized magnetron sputtering systems, target materials, and non-destructive measurement systems.
The company adheres to the development concept of "technological self-reliance to help the dream of building a strong country", actively advocates the entrepreneurial spirit of "knowing with fear in the heart, fearless in action", and aims to become a "domestic leader in the field of semiconductor diaphragms". It is committed to researching and developing new technologies, processes, and materials, providing customized products and process manufacturing solutions according to customers' actual needs. Its downstream applications involve multiple fields such as acoustic devices, inertial sensing, inkjet printing, and ultrasonic probes.

At present, we have a sound and stable management team and technical strength. The leader is an associate professor appointed by Shanghai Jiao Tong University. The team is composed of management personnel who have been engaged in listed companies for many years and graduates from top universities such as Shanghai Jiao Tong University, Fudan University, and Shandong University. They have multiple independent intellectual property rights. The company adopts a business model of design+production+sales, which mainly includes the design and sales of dedicated magnetron sputtering systems, target materials, non-destructive measurement systems, and the production and sales of piezoelectric thin film wafers. At present, it has the independent production capacity of piezoelectric thin film wafers, and the automation system is at the leading level in the industry. Breakthroughs have been made in the performance of various products, forming a unique competitive advantage in China.
In the face of new situations and tasks, the company will always be guided by the national development strategy, deeply cultivate "bottleneck" technology research and development, actively practice the integration of industry, academia, research and application, accelerate project implementation, and contribute to the establishment of the domestic MEMS ecosystem.
Year by year
Established in 2017, with ten years of experience in oxide vacuum deposition
Year by year
The first 8-inch PZT continuous vacuum coating equipment in China has been put into operation
Year by year
Successfully developed 8-inch high voltage and high uniformity PZT wafer
10000 pieces per year
The production capacity of a single mass-produced equipment reaches 50000 pieces per year